Abstract
The evaluation of the operational lifespan of solder joints in electronic devices, especially when subjected to intricate mission profiles, stands as a pivotal imperative in the domain of electronic material design. In response to this critical concern, this study introduces an innovative methodology designed to discern between gradual and sudden failures, offering a nuanced exploration of the distinct failure mechanisms at play. Distinguishing itself through a sophisticated treatment of failure mechanisms—specifically, the incorporation of thermomechanical fatigue and vibration-induced mechanisms—within the context of solder joint degradation, the proposed approach significantly elevates the precision and accuracy of reliability evaluations. This refined methodology emerges as a valuable contribution to the field, promising more insightful and reliable results in the assessment of electronic device durability under diverse and complex operational conditions.
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