Abstract
A new bakable pneumatic silicon microvalve has been developed by micromachining for advanced semiconductor device fabrication. This microvalve is composed of an anodically bonded glass - silicon - glass structure and it is further bonded to a Kovar alloy block which has stainless steel tubes. The gas flow rate could be controlled from 0.5 sccm to 50 sccm at an inlet pressure of . This microvalve can be used in the temperature range from 25 to .
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