Abstract
A hybrid silicon-carbide junction-gate field-effect transistor (HJT: hybrid JFET) is proposed. The HJT consists of a silicon-carbide (SiC) normally-on vertical JFET and a low-voltage normally-off silicon metal-oxide-semiconductor field-effect transistor (Si-MOS: silicon MOSFET). These two devices are connected by bonding wire as a cascode circuit [1] and packaged in a TO-3P split-lead-frame package with the same pin arrangement as conventional silicon power devices, which can thus be easily replaced by the proposed HJT. The vertical JFET has a steep-junction deep-trench structure in its channel region. This structure gives a low on-state resistance of under 60 mΩ and breakdown voltage of over 600 V with the die size of 6.25 mm2. Since the deep-trench structure also lowers the cutoff voltage of the JFET, required minimum breakdown voltage of the Si-MOS is reduced and on-state resistance of the Si-MOS is lowered. The HJT demonstrated on-state resistance of 69 mΩ and breakdown voltage of 783 V. These results indicate that the proposed HJT is a strong candidate for low-resistance high-power switching devices.
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