Abstract
A 6.5kV, wire-bondless power electronics module with a double-sided cooling is proposed and evaluated. A direct solder attachment is employed to minimize parasitic circuit elements and increase current handling capability as well as to enable a double-sided cooling capability with mechanical robustness. Finite element simulations were performed to investigate the thermal performance, critical breakdown voltage and mechanical stresses of the power electronic module. The active devices in the proposed modules were demonstrated to withstand a 6.5kV breakdown voltage with a reasonable leakage current. The parasitic inductance is also modeled and compared between wire-bonded and wire-bondless power module. The mechanical and electrical performance of the power module agreed well with simulation results.
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