Abstract

This paper presents a 60 GHz millimeter-wave (mm-wave) antenna array using standard printed circuit board (PCB) for 3D Antenna-in-package (AiP) implementation. The array consists of a 4 microstrip patch elements, differentially fed with an open stub matching feed network to enable 3D integration. The $1\times 4$ finite antenna array with ball grid array (BGA) and silicon (Si) interposer operates from 58.46 to 62.14 GHz with 3.6 GHz instantaneous bandwidth, low mutual coupling of about $1\times 4$ array consists of two substrates and one bondply layer with antennas, via-to-open stub matching network, and a differential to single-ended corporate feed network for the measurement. A prototype with a differential to single-ended corporate feed network was fabricated and tested showing a gain of about 10.02 dBi at the operating frequency with $\geq 90$ % radiation efficiency. Such a gain and efficiency make the presented design a leading candidate for 3D AiP applications.

Highlights

  • T HE need for fast data processing and high data rates is increasing exponentially and exceed the limits of current available technologies

  • The large pathloss can be overcome by utilizing high gain antenna arrays and by performing beamforming techniques

  • We extend the work in [10] to include a standard printed circuit board (PCB) multilayer array design considering ball grid array (BGA) and Si interposer and for the measurement purpose alone, we fabricated an array prototype

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Summary

Introduction

T HE need for fast data processing and high data rates is increasing exponentially and exceed the limits of current available technologies. The radio frequency (RF) spectrum (

Methods
Conclusion

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