Abstract
This paper presents a 60 GHz millimeter-wave (mm-wave) antenna array using standard printed circuit board (PCB) for 3D Antenna-in-package (AiP) implementation. The array consists of a 4 microstrip patch elements, differentially fed with an open stub matching feed network to enable 3D integration. The $1\times 4$ finite antenna array with ball grid array (BGA) and silicon (Si) interposer operates from 58.46 to 62.14 GHz with 3.6 GHz instantaneous bandwidth, low mutual coupling of about $1\times 4$ array consists of two substrates and one bondply layer with antennas, via-to-open stub matching network, and a differential to single-ended corporate feed network for the measurement. A prototype with a differential to single-ended corporate feed network was fabricated and tested showing a gain of about 10.02 dBi at the operating frequency with $\geq 90$ % radiation efficiency. Such a gain and efficiency make the presented design a leading candidate for 3D AiP applications.
Highlights
T HE need for fast data processing and high data rates is increasing exponentially and exceed the limits of current available technologies
The large pathloss can be overcome by utilizing high gain antenna arrays and by performing beamforming techniques
We extend the work in [10] to include a standard printed circuit board (PCB) multilayer array design considering ball grid array (BGA) and Si interposer and for the measurement purpose alone, we fabricated an array prototype
Summary
T HE need for fast data processing and high data rates is increasing exponentially and exceed the limits of current available technologies. The radio frequency (RF) spectrum (
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