Abstract
A 48-turn thin-film head has been developed. The copper coils were electroplated through minute resist frames which were fabricated by a reactive ion etching (RIE) process. The problem of the redeposited copper underlayer in the RIE was solved using ECR (electron cyclotron resonance) plasma equipment. The output voltage of the 48-turn head was in proportion to the track width and number of coil turns. With a 6.5- mu m track width head, a recording density of 150 Mb/in/sup 2/ was achieved.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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