Abstract
Common mode filters (CMF) are widely used to ensure signal integrity. However, due to the large area, traditional CMFs cannot meet the eager demand for the miniaturization of modern communication systems. In this paper, a three-dimensional integrated CMF based on through silicon vias (TSV) technology is proposed. The adoption of TSV technology greatly reduces the area of CMF. The structure is modeled and simulated by HFSS software. The stopband of the common mode signal is 7.9 GHz ~ 18.8 GHz. In the operating frequency band, the effect of group delay jitter on frequency is less than 10 ps. Moreover, the plane area of the CMF is only 0.195 mm2.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
