Abstract

A synchronous dual-port memory employing a three-transistor (3T) dynamic cell has been designed for use as a high throughput embedded data buffer in digital switching and signal processing applications. Skewed-clock pipelining is used to achieve operation at frequencies as high as 250 MHz with a low register element count. The 3T cell provides separate read and write access ports while occupying less than half the area of a conventional dual-port SRAM cell. On-chip Hamming error correction coding (ECC) is used to enhance the fault tolerance of the memory, A 25-kb experimental prototype has been integrated in a 0.8-/spl mu/m CMOS technology; it occupies a die area of 3800 /spl mu/m/spl times/1600 /spl mu/m and dissipates 420 mW while operating at 250 MHz.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.