Abstract
A multihighway serial/parallel (S/P) converted LSI chip suitable for the broadband Integrated Services Digital Network (B-ISDN) node interface is presented. The chip, fabricated with 0.8- mu m BiCMOS technology, handles 32-highway*8 b of S/P, P/S conversion at up to 250 Mb/s and has a power dissipation of 700 mW. The chip features cross-access memory and a current-cut-type CMOS/ECL interface circuit. Each of these features is described and evaluated. A newly developed BiNMOS-type D-flip-flop (D-FF) is used to speed up the cross-access memory and is compared to a CMOS D-FF. >
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