Abstract
We describe a high-performance, 12-channel multimode fiber-optic receiver array using a combined multichip module laminate (MCM-L), chip-on-board (COB), and ball grid array (BGA) packaging technology. The array operates at a minimum speed of 1.0625 Gb/s per channel with good channel-to-channel uniformity. Each channel has sensitivity better than /spl sim/18 dSm and dynamic range better than 12 dB. Other important characteristics are good uniformity in rise time, fall time, and peak-to-peak output voltage amplitude across all the channels. The results demonstrate this OE receiver array packaging approach is applicable for a wide variety of platforms that have very stringent requirements in high packaging density, high performance, and low cost.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
