Abstract
A combined РИТМ-СП facility intended for forming thin alloy layers on the sample surface during the single vacuum cycle (in situ) is described. The facility consists of a low-energy (10–30 keV) high-current (up to 25 kA) pulsed (2–4 μs) electron beam source and a magnetron sputtering device mounted together with the electron gun of the source on the common vacuum working chamber. The chamber is equipped with the manipulator intended to move the working table with samples without vacuum failures. The facility contains a computer-aided system for controlling the pumping, filling of the chamber with the working gas, power supply units, synchronization of pulse processes during the generation of the electron beam, deposition of films, displacements of the sample, etc. To illustrate the operation of the facility, results of experiments on surface alloying for the Ni-Cu system are given.
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