Abstract
A detailed study has been made of helium release from silicon wafers implanted with MeV helium ions at fluences of 5×1016 cm−2 and 1017 cm−2. Thermal desorption spectrometry (TDS), neutron depth profiling (NDP), non-Rutherford elastic backscattering (NREBS) and nuclear reaction analysis (NRA) have been employed to measure the helium content and release rate during isothermal annealing at annealing temperatures of 800 and 1000°C. TDS has also been used for isochronal annealing. Transmission electron microscopy (TEM) is used to monitor changes in morphology in the formed bubble layer. The helium release results can be modeled rather well when it is assumed that the helium initially is present in overpressurized bubbles. The present study reveals a single activation energy for helium release of 1.83 (0.05) eV.
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