Abstract
The fatigue life estimation on micro solder joints is one of the most critical technology for the reliable IC packages. For the accurate estimation of the thermal fatigue life based on the finite element analysis, an inelastic constitutive model which can describe the time dependent deformation has been required. In this study, in order to investigate the applicability of the proposed constitutive model for Sn-Ag-Cu lead-free solder, the finite element analysis was carried out for the solder joint in a quad flat package. As a result, it was found that the inelastic deformation of the lead-free solder was successfully simulated.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
