Abstract
This paper presents the development of tensile test technique for evaluation of elastic properties of MEMS materials in order to reliably design MEMS. A compact tensile tester operating in X-ray diffraction system was newly developed to measure Young's modulus, Poisson's ratio and fracture strength of micro-sized single/poly crystalline materials. Changes of X-ray diffraction patterns with increasing a tensile stress directly derived lateral strains of single crystal silicon (Si) specimens. Averaged value of Young's modulus and Poisson's ratio of the specimens was 168 GPa and 0.270,respectively, in agreement with analytical values calculated from anisotropic theory. This technique has, therefore, great potential for evaluating mechanical properties of micro-sized materials.
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