Abstract
None film surface of TFT glass will be damaged varying degrees due to physical contact with array equipment, which will seriously reduce the strength of none film surface. In this paper, we clarified the physical damage caused by the dry etch equipment on none film surface of TFT and its impact on the strength reduction through multiple verifications in array process. It is proved that strength reduction is mainly related to the back electrode material of dry etch. By changing the back electrode material from M to N(code name), the strength of the acrylic ball drop increased by more than 500%, and the strength of the cell ROR increased by 57%. This research has greatly improved the strength of none film surface of LCD, which is great significant to product performance improvement and new product certification.
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