Abstract
We used simultaneous transfer and bonding (SITRAB) technology to fabricate a full‐color Mini‐LED display on a flexible substrate. SITRAB technology is ETRI's patented technology that integrates transfer and bonding into a single process. We adopted a 25 μm‐thick polyimide film as the display substrate. RIGIB Mini‐LEDs were arrayed on a glass carrier as a 32 × 32 array. RIGS Mini‐LEDs on twelve glass carriers were transfer‐bonded to the display substrate through a tiling process. The fabricated display consists of 64 × 64 color pixels, which are connected in a passive matrix
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