Abstract
In the frame of the ALLIANCE program between Motorola, Philips Semiconductors and STMicroelectronics, electron beam direct write (EBDW) lithography based on shaped beam projection is employed to start quickly an aggressive 65 nm program for the printing of all critical levels. This paper reviews the economical opportunities offered by the introduction of electron beam (E-Beam) lithography for prototyping and advanced research and development applications. EBDW process integration capabilities are also demonstrated, confirming after electrical validation, the real possibilities of EBDW solution for application specific on integrated circuit (ASIC) manufacturing.
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