Abstract
Numerical simulation was performed to investigate module stacking design and optimization in inner‐folding water‐drop flexible panel. Some influencing factors on module stacking design, such as the thickness and the modulus of cover, optical clear adhesive (OCA), bottom film (BF) and bending device were analyzed and designed. The result shows that, in the inner‐folding water‐drop module, the strain of optical clear adhesive (OCA) increases significantly which occurs in the cohesive failure area during the bending test, and the touch sensor plane (TSP) top surface and the display function layers (AMOLED) bottom surface are the locations where cracks occurred easily. Cover with the characteristics of thicker and higher modulus will increase the OCA deformation and function film strain. Adopting a type of thicker OCA will be help for solving the cohesive failure occurred in OCA1 but will not increase the failure risks occurred in OCA2 and function films. Both of OCA2 and display function film strains decrease fast with the increasing of BF modulus, meanwhile, thicker BF will increase the peeling risk. Optimized bending device not only could improve the bending ability but also could provide larger space for the design of terminal products.
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