Abstract
This paper present a summary of the development of Antenna-in-Package (AiP) technology in a low-temperature co-fired ceramic (LTCC) process for highly-integrated 60-GHz radios. The AiP exploits the LTCC capability to integrate the antenna and package functions into a compact three-dimensional structure of size 12.5×8×1.265 mm3. The antenna consists of a radiator, a ground plane, and a guard ring. It is shown that our AiP designs achieve excellent antenna performance in the 60-GHz band with an estimated efficiency better than 90%. Simulated and measured impedance and radiation results are compared. They agree reasonably well, indicating that the challenge in the antenna technology for low-power high-speed 60-GHz wireless communications has been solved.
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