Abstract
Copper is widely used as a functional component because of its high electric and thermal conductivity, the excellent corrosion resistance and the property of plastic forming. On the other hand, friction stir welding (FSW) can join materials below the melting point. Although a conventional FSW joins two plates, this study is applied friction stir processing technology (FSPT) as the high reliability junction technology in three-dimensional structure. In order to evaluate the stack-bonding technology of copper plate, observation of microstructure around the joint area is conducted.
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