Abstract
We demonstrate a novel ultra‐precise deposition (UPD) technology for printing of micrometer size, mechanically robust, and high‐conductivity interconnectors in micro‐LED (µLED) displays. UPD allows maskless deposition of highly‐concentrated silver inks (even 85% wt. of metal content) on steps much higher than the width of the printed structure. The printed feature size is as small as 1 micrometer with the electrical conductivity up to 45% of bulk silver.
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