Abstract
Phase shifting moire interferometry was developed by using wedged glass plate. This technique was employed to measurement of thermal deformation of electronic package, Stacked-MCP (Multi Chip Package). A thermal loading was applied by heating the devices from room temperature 25℃ to an elevated temperature 100℃. The experimental results showed that large shearing and bending deformations were yielded. The microscopic strain distributions around the chips and resin were quantitatively determined.
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