Abstract

AbstractOrganic light‐emitting displays can be made as thin as the substrate if thin film packaging is used. We propose a novel multi‐layer stack of silicon nitride ‐ silicon oxide ‐ silicon nitride ‐ silicon oxide ‐ silicon nitride (NONON) as thin film encapsulation. We present results on the barrier properties of this stack and present a working passive matrix Polymer OLED demonstrator. The water permeability of a single NON‐stack deposited at 85 ° C was measured to be less than 1*10−6g/m2 day. The compatibility with the OLED structure itself and results on device operation will be shown.

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