Abstract
The market for MicroLED displays is strongly growing in all segments from very small AR/VR to very large TV and signage displays. For a successful market adoption costs of MicroLED displays must be significantly reduced. The entire supply chain is working on different proposals. Roadmaps have already shown where MicroLED sizes need be reduced to 5 μm while the processing times of such displays must be reduced by factors. It is obvious that more precision processing equipment with increased throughput is needed to fulfil future market requirements. Laser are known for their precision and scalability and therefore a key to successful commercialization of MicroLED displays. In this paper we will describe the two critical processes during MicroLED manufacturing, the Lift‐Off process where the Gallium Nitride (GaN) MicroLED's need to be released from the growth wafer, and later be transferred to a substrate.
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