Abstract
기판 집적 도파관(Substrate Integrated Waveguide: SIW) 기술을 이용한 Ka 밴드의 35 GHz용 <TEX>$4{\times}4$</TEX> 평면 배열 안테나를 제시한다. 전체 안테나 구조는 3층의 PCB(Printed Circuit Board) 적층 형태로 구성되며, top PCB에는 45도로 기울어진 직렬 방사 슬롯이 평면 배열로 방사부를 이룬다. 또한, 균일한 전력을 전달하고 안테나 전체 단면적을 최소화하기 위해 middle 및 bottom PCB에는 급전 SIW가 위치한다. 전체 안테나 개구면의 면적은 <TEX>$750.76mm^2$</TEX>이며, 유전율 2.2의 RT/Duroid 5880 기판을 적층하여 설계하였다. 각 방사부 및 급전부의 개별적인 전기적 특성은 full-wave 시뮬레이터인 CST MWS를 이용하여 확인하였다. 나아가 제안된 평면 배열 안테나는 대역폭 (490 MHz), 최대 이득(18.02 dBi), 부엽 레벨(-11.0 dB), 교차 편파 레벨(-20.16 dB)의 전기적 특성을 보인다. The 4 by 4 series slot sub-array antenna is proposed using substrate integrated waveguide(SIW) technology for 35 GHz of Ka band application. The proposed antenna is realized with multi-layered structure for compact size and easy integration features. 4 by 4 radiating slots are arrayed on top PCB with equal spacing and the feeding SIWs are arranged on middle and bottom PCBs for uniform power distribution. The multi-layered antenna is realized using RT/Duroid 5880 that has dielectric constant of 2.2 and the total antenna size is <TEX>$750.76mm^2$</TEX>. The individual parts such as radiators and feeding networks are simulated using full-wave simulator CST MWS. Furthermore, the total sub-array antenna also fabricated and measured the electrical performances such as impedance bandwidth under the criteria of -10 dB(490 MHz), maximum gain(18.02 dBi), sidelobe level(SLL)(-11.0 dB), and cross polarization discrimination (XPD)(-20.16 dB).
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