Abstract
We have developed a highly reliable memory module by modifying the dimensions of a tape carrier package (TCP). As the TCP is thin, it is a suitable structure for stacking. However, such thinness results lower flexural rigidity and shorter outer leads. Because of these features, the factors that control solder-joint reliability in the case of a TCP differ from those in the case of conventional package structures like a thin small outline package (TSOP). We evaluated the reliability of a solder-joint under temperature-cycling testing by using finite element methods. As a result, it was found that the distance from the chip edge to the solder edge on the substrate affects reliability considerably. It is thus concluded that increasing this distance, concentration of plastic strain can be reduced and solder-joint reliability can thus be improved.
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