Abstract
Abstract This paper describes the design and modeling of through-silicon via (TSV)-based high-density 3D inductors for Internet of Things (IoT) applications and presents some possible challenges for TSV-based inductors in IoT applications. For cybersecurity infrastructure, we designed IoT with hardware security in mind. We provide a secure design for Internet of Things based on secure 3D inductors and then show case studies of high-density RF packages with TSV-based inductors that require hardware security, such as military applications. We use ferromagnetic materials to achieve high inductance with good quality factor.
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