Abstract
Edge couplers connecting the optical fiber and the on-chip waveguide are indispensable devices in integrated photonics. In this study, a 3D edge coupler with trapezoidal cross-section is proposed and designed. High coupling efficiencies of the edge couplers are verified by theoretical calculations. The 3D trapezoidal edge couplers are fabricated on the thick-silicon layer of a Silicon-on-Insulator (SOI) substrate by using 3D grayscale lithography. Over the communication band (C-band), the fiber-to-chip measured results indicate that the maximum coupling efficiency of the 3D edge coupler is 0.68/0.99 dB for the TE/TM mode. The misalignment tolerances are less than 0.65 dB and 0.90 dB for the TE and TM modes within ±5 μm in the horizontal direction. The same measured values are less than 0.60 dB for both the TE and TM modes within 4 μm in the vertical direction. The excellent coupling characteristics of the 3D edge coupler are attractive for the large-scale photonic integration.
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