Abstract
In article number 1700068, John A. Rogers, Ralph G. Nuzzo, and co-workers present direct ink write (DIW)-assisted integration of soft and cellular materials onto compressively buckled microframeworks that are constructed using polymer or high performance silicon semiconductor membranes. These scaffolds provide unique 3D environments upon which to study cellular migration and hydrogel integration. The cover was designed by Joselle M. McCracken.
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