Abstract
This study demonstrates the possibility of forming 3D structures with enhanced thermal conductivity (k) by vat printing a silicone–acrylate based nanocomposite. Polydimethylsiloxane (PDSM) represent a common silicone-based polymer used in several applications from electronics to microfluidics. Unfortunately, the k value of the polymer is low, so a composite is required to be formed in order to increase its thermal conductivity. Several types of fillers are available to reach this result. In this study, boron nitride (BN) nanoparticles were used to increase the thermal conductivity of a PDMS-like photocurable matrix. A digital light processing (DLP) system was employed to form complex structures. The viscosity of the formulation was firstly investigated; photorheology and attenuate total reflection Fourier-transform infrared spectroscopy (ATR-FTIR) analyses were done to check the reactivity of the system that resulted as suitable for DLP printing. Mechanical and thermal analyses were performed on printed samples through dynamic mechanical thermal analysis (DMTA) and tensile tests, revealing a positive effect of the BN nanoparticles. Morphological characterization was performed by scanning electron microscopy (SEM). Finally, thermal analysis demonstrated that the thermal conductivity of the material was improved, maintaining the possibility of producing 3D printable formulations.
Highlights
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Thermal behavior is critical in several electronic applications such as electronic packaging, 30]. Three-dimensional (3D) chip stacks, automotive electronic-unit controls and batteries
Thermal dissipation is a challenging problem that still requires the improvement of materials with enhanced thermal conductivity [1]
Summary
Thermal behavior is critical in several electronic applications such as electronic packaging, 3D chip stacks, automotive electronic-unit controls and batteries. Thermal conductivity (k) describes the ability to conduct heat flow; such a property has been widely studied for polymer applications and processing [1,2,3]. Thermal conductive pads are popular for cooling low power devices, such as chip sets and mobile processors, typically, they are composed of a silicone, or similar elastomeric matrix, filled with ceramic or metal particles [4,5]. Polymers usually present low thermal conductivity, i.e., less than 0.5 W/mK, around 0.15–0.27 W/mK. Tailoring the thermal properties of the pad become crucial [6]
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