Abstract

AbstractOrganic–inorganic perovskite quantum dot (PQD)–polymer composites are emerging optoelectronic materials with exceptional properties that are promising widespread application in next‐generation electronics. Advances in the utilization of these materials depend on the development of suitable fabrication techniques to create 3D architectures composed of PQD–polymer for sophisticated optoelectronics. This study introduces a straightforward and effective method for producing 3D architectures of PQD‐encapsulated high‐performance composites (PQD‐HPCs) through direct‐ink writing (DIW). This method employs an ink composed of prefabricated PQDs and hydroxypropyl cellulose (HPC) in dichloromethane (DCM). HPC, an appropriate organic‐soluble polymer, exhibits optical transparency in the highly volatile DCM and enables the formulation of a stable, room‐temperature extrudable ink. The architectures, which are printed by adjusting the halide ratios (Cl, Br, and I) for the compositions of CH3NH3PbBr1.5I1.5, CH3NH3PbBr3, and CH3NH3PbBr1.5Cl1.5, exhibit single peak photoluminescence emissions of red (639 nm), green (515 nm), and blue (467 nm). Optimizing the printing parameters of DIW enables the precise fabrication of programmed and complex PQD‐HPC 3D architectures for advanced anti‐counterfeiting and information encryption. This method has the potential to enhance the functionality of modern printed electronic devices significantly.

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