Abstract

Electronically conductive hydrogels integrated with dielectric elastomers show great promise in a wide range of applications, such as biomedical devices, soft robotics, and stretchable electronics. However, one big conundrum that impedes the functionality and performance of hydrogel-elastomer-based devices lies in the strict demands of device integration and the requirements for devices with satisfactory mechanical and electrical properties. Herein, the digital light processing three-dimensional (3D) printing method is used to fabricate 3D functional devices that bridge submillimeter-scale device resolution to centimeter-scale object size and simultaneously realize complex hybrid structures with strong adhesion interfaces and desired functionalities. The interconnected poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) network endows the PAAm hydrogel with high conductivity and superior electrical stability and poly(2-hydroxyethyl acrylate) functions as an insulating medium. The strong interfacial bonding between the hydrogel and elastomer is achieved by incomplete photopolymerization that ensures the stability of the hybrid structure. Lastly, applications of stretchable electronics illustrated as 3D-printed electroluminescent devices and 3D-printed capacitive sensors are conceptually demonstrated. This strategy will open up avenues to fabricate conductive hydrogel-elastomer hybrids in next-generation multifunctional stretchable electronics.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.