3D Printing Nano‐Architected Semiconductors Based on Versatile and Customizable Metal‐Bound Composite Photoresins

Abstract

AbstractSemiconductors are the cornerstones of the current information age. Next‐generation integrated optoelectronics calls for ultrahigh‐resolution manufacturing of sophisticated three‐dimensional (3D) semiconductor products, which introduces tremendous challenges for conventional planar lithography techniques. State‐of‐the‐art 3D printing techniques are promising but hampered by the absence of functional precursors for semiconductor formation. Here, a facile method to synthesize versatile and customizable metal‐bound composite photoresins for 3D printing various nano‐architected metal oxide semiconductors is reported. These photoresins can be readily synthesized using metal‐organic framework (MOF) precursors and commercially available monomers, which are free of the nanoparticle‐induced scattering effect. Arbitrary 3D architectures of metal oxide semiconductors (e.g., ZnO and Co3O4) are additively manufactured with a high resolution of 170 nm, high shape fidelity, and high surface quality. A ZnO‐based micro‐ultraviolet photodetector is fabricated to demonstrate its potential applications in optoelectronic devices. The versatile photoresins are expected to have broad applicability for various functional materials and pave the way for the fabrication of 3D integrated functional devices.