3D printed cellulose nanofiber/silica nanoparticle scaffolds for daytime radiative cooling

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The high degree of modularity and miniaturization of nanoelectronic devices results in a significant increase in heat flux per unit area of electronic components. This can cause a rise in temperature, especially when used outdoors under direct sunlight conditions, which can negatively impact their operational stability and service life. Traditional radiators have limited effectiveness in outdoor sunlight conditions. Additionally, conventional heat sinks are often too large and heavy for miniature electronic devices. Therefore, finding an effective solution to cool electronics under sunlight conditions remains a challenge. Herein, we present an innovative solution to fabricate 3D-printed coolers for electronic devices based on the methyltrimethoxysilane/silica/cellulose nanofibers (MSC) ink. 3D printing technology enables the fabrication of radiative coolers with complex structures and efficient cooling performance as needed. The combination of CNFs and SiO₂ nanoparticles, coupled with the porous nature of the structure, enables the 3D-printed MSC scaffold to exhibit excellent solar reflectance and high mid-infrared (MIR) emissivity, thereby facilitating superior radiative cooling capabilities. During the daytime, it can efficiently reduce the temperature of electronic devices by 6.16 °C, thereby improving their operational efficiency and service life. Furthermore, the 3D-printed MSC scaffold exhibits superior mechanical properties due to the robust 3D frame structure formed by the ink components, which provides stability for the electronic device during operation. This study presents an innovative approach to developing electronic device coolers with excellent cooling performance, which is significant in promoting the reliability and stability of electronic devices.