3D Packaging Technology: Enabling the next wave of applications

Abstract

This paper describes 3D Packaging Technology trend and highlights its contribution to the development of the next wave of electronic products. The paper's introduction discusses general Packaging Technology trends in the semiconductor industry and the major Packaging Functionality changes that have been experienced during the last few decades. It also covers some of the future functions that will be performed by packaging technology such as system in packages to enable autonomous smart electronics, with heterogeneous technology such as signal processing, sensors, power management, energy harvesting modules and nano storage devices. It describes the evolution of 3D packaging technology in three different waves or phases. It also presents some of the Megatrends enabled by 3D Packaging, Miniaturization and Integration, as well as the main challenges the industry is experiencing with the development and implementation in volume production of the third wave, Through Silicon Vias (TSV). The final section of this paper discusses TSV drivers and benefits, the expected Value Added coming from TSV vs. Required Cost to Develop and Implement, and whether TSV is going to be used in mostly “Niche High Value Added” applications or adopted as a Mainstream solution for many applications.