Abstract

3D numerical simulation of gas heating in a magnetron sputtering system is performed. Pressure, magnetron power density and location of the substrate plane in front of the target are shown to affect the gas temperature profile. For the pressure range under study, maximum gas temperature is shown to increase with pressure. By increasing the separation between the target and the substrate, the maximum gas temperature is shown to increase up to the point when most of the particles are assumed thermalized. Cu shows more gas heating than does Al due to its higher sputtering yield and energy transfer efficiency. Sputtered particles are shown to be the major source of gas heating.

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