Abstract
ABSTRACTHeat removal via thermal management materials is attracting more and more attention in the electronic industry. Conventional particle/polymer thermal conductive composites require a high filler loading ratio (>30 vol %), which cause severe thermal interfacial resistance and mechanical issue. In this work, we fabricate tellurium nanowires (NWs)/epoxy nanocomposites via a facile bar coating method. According to Agari model and Maxwell–Eucken model, the as‐synthesized ultra‐long NWs with high aspect ratio (>100) construct the 3D interconnected thermal conductive network better in resin matrix to facilitate the heat transfer process. The results show that at a low loading ratio of 2.4 vol %, this nanocomposite exhibits the out‐of‐plane and in‐plane thermal conductivity of 0.378 and 1.63 W m−1 K−1, respectively, which is 189 and 715% higher than that of pure epoxy resin. Importantly, good stability, and flexibility of nanocomposites are well maintained. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47054.
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