Abstract
(2013년 8월 26일 접수: 2013년 9월 9일 수정: 2013년 9월 16일 게재확정 )Abstract: 3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a devicescales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D ICtechnology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging.However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturingyield, and device test. Especially for high density and high performance devices, power density increases significantlyand it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling systemhas been reviewed as one of device cooling methods for the next generation thermal management.Keywords: TSV, Liquid Cooling, Interconnect, 3D IC, Thermal management
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
