3D heterogeneous photonic electronic integrated circuits (Conference Presentation)

Abstract

We will discuss 2D and 3D photonic integrated microsystems designed for coherent synthesis, processing, and detection of optical waves in temporal, spectral, and spatial domains. The talk will be in three parts addressing applications in future communication, computing, and imaging systems. The 3D photonic integrated circuit (PIC) platform exploits direct inscribing of arbitrarily shaped waveguides using femtosecond lasers. In one example, such a 3D PIC allows arbitrary beam forming for spatial division multiplexing using orbital angular momentum states. We will further discuss 2D integrated photonic technologies based on InP, silicon, and silica material platforms. Examples at UC Davis include > THz coherent optical transmitters and receivers on a monolithically integrated InP platform, silicon photonic RF-photonic lattice filters, silicon-photonic optical routers, and photonic-lanterns. Dynamic optical arbitrary waveform generation and measurement (OAWG and OAWM) technologies enable > THz scale coherent optical transmission systems with arbitrary modulation formats and bandwidth. Integrated 3D devices can realize arbitrary spatial beam forming and beam steering. We will also demonstrate a silicon-photonic switch which realizes all-to-all interconnection of > 1000 computing nodes, and discuss a compact interferometric imaging system realized on 2D/3D photonic integrated circuits. Finally, we will address future prospects of the new 2D/3D photonic integration technologies towards realizing future communication, computing, and imaging systems.