3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance

Abstract

Abstract A novel 3D conductive heat transfer model was developed based on node temperature inheritance. Heat transfer of the mold and billet could be analyzed synchronously. In the model, heat transfer in the copper wall was in a steady state, whereas heat transfer in the billet was in a transient state. The temperature distribution indicated that the maximum temperature on the copper wall reached approximately 30 mm below the meniscus. The results were in better agreement with industrially measured data than those of traditional 2D heat transfer models. The model was applied to study the effect of water scale on heat transfer of a billet mold. When the scale thickness increased from 0 to 0.5 mm, the maximum temperature on the copper wall increased from 174 °C to 364 °C, which will lead to mold deformation and peeling of the coating. In addition, the shell thickness slightly decreased with increasing scale thickness.