3D-FEM electrical–thermal–mechanical analysis and experiment of Si-based MEMS infrared emitters

Abstract

Designs, simulations, and fabrications of silicon-based MEMS infrared (IR) emitters for gas sensing application are presented. A 3D finite element method (3D-FEM) was used to analyze the coupled electrical–thermal–mechanical properties of a bridge hotplate structure (BHS) IR emitter and closed hotplate structure (CHS) IR emitter using Joule heating and thermal expansion models of COMSOL™. The IR absorptions of n- and p-silicon were calculated for the design of self-heating structure. The BHS and CHS IR emitters were fabricated synchronously using micro-electromechanical systems technology for a direct performance comparison. Both types of IR emitters were characterized by electrical and optical measurements. The experimental results show that BHS IR emitters have higher radiation density, lower power consumption, and faster frequency-response than CHS IR emitters due to the use of a thermal isolation structure and self-heating structure. Meanwhile, the simulated results agree well with the corresponding measured results, which indicate that the 3D-FEM-model is effective and can be used in the optimal design of electro-thermal devices.