Abstract
In this work, a novel 3D CMOL crossnet structure is introduced by combining two leading technological concepts for future nanoelectronic neuromorphic networks: CMOL crossnet and 3D integration. By implementing CMOL crossnet into the third dimension, the proposed 3D CMOL crossnet not only maintains the high-speed and high defect-tolerant properties of the CMOS-nano hybrid CMOL hardware system, but also provides efficient fabrication and assembly processes with a much higher density than the original CMOL crossnet. Furthermore, this study focuses on the development of multivalue synapses and efficient communication methods between CMOS and nanodevices. Preliminary results demonstrate that the structure can utilize the advantages of high performance synapses and stable analog CMOS somas in three dimensions. Therefore, the proposed 3D CMOL crossnet structure has a huge potential to become an efficient 3D hardware platform to build neuromorphic networks that are scalable to biological levels.KeywordsCMOS-Nano Hybrid SystemCMOLCrossnetNeuromorphic Network3D IC
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
