3D analytical solutions of piezoelectric thin film structure under charged cylinder flat head contact

Abstract

In the system of the transversely isotropic piezoelectric thin film structure under charged cylinder flat head contact, the 3D analytical solutions for the stresses, displacements, electric displacements and electric potential are derived, which is a further development of the contact mechanics theory. We find that the variation tendency of the stresses and electrical components not always monotonically while thickening the film thickness. Even if the structure is under pressure (no tangential force loading on the contact area), the shear stress is singularity at the contact boundary. The optimal thickness can be determined with an optimization procedure. Interfacial delamination area can be predicted with interfacial failure criterion. The theoretical results are helpful for the prediction of some transient electrical effects, which can be combined with experiments to estimate some elastic constants, dielectric constants and piezoelectric constants in the indentation process.