3951 電解めっき銅薄膜の微細組織と強度物性(S21-2 静的強度評価,S21 ナノ・マイクロ構造体の強度物性と信頼性)

Abstract

Young's modulus of electroplated copper thin films was measured by using a tensile test and a nano-indentation method. The anisotropic Young's modulus was measured in the films, i.e., 20-45GPa in a horizontal plane and 60-90GPa along the thickness direction. The films consisted of mixture of large columnar grains with about 5μm diameter and small grains with about 0.5μm diameter.