Abstract
A drilling process to the difficult to cut material such as ceramics, hardened steel, glass and heat-resistant steel is widely requested in the industrial world. In order to achieve sub-millimeter drilling process, ultrasonically assisted machining is suitable to machine difficult-to-cut materials precisely. In this report, high speed camera based on photoelastic analysis realized the visualization of process of ultrasonic drilling. The work materials are silica glass. For the conventional drilling, the stress distribution diagram showed the intensive stress occurred under the chisel because the chisel edge of drill produces large plastic deformation. On the other hand, the ultrasonic drilling produced spread stress distribution and stress boundary far away from the chisel. Furthermore, for ultrasonic drilling, the chipping or cracking of inner wall was is influenced considerably by cutting fluid.
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