Abstract
The plastic deformation of silicon wafers caused by micro-indentation was studied by means of HRTEM. It was shown that under a low maximum indentation load (P_ ) the transformation zone is amorphous but its boundary is rough and nano-crystals of diamond silicon appear near an amorphous / crystalline border. Increasing P_ gives rise to crystalline high-pressure R8/BC8 phases in the transformation zone. The size of high-pressure phase grains varies between 3 nm and 15 nm, suggesting a coherent nucleation and growth mechanism. The micro-deformation outside the transformation zone proceeds by initial distortion of crystalline planes concentrated in nano-zones accompanied by initiation of dislocations that are advanced to slip systems. Details of the microstructure and its effect on the nano-deformation in micro -indentation are also discussed.
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