Abstract
Solar cells in photovoltaic modules are generally bonded by soldering which requires heating to a temperature of 220℃ or higher. As a result the different thermal expansion coefficients of different materials in the system cause mechanical stress, leading to deformation that reduces expected field lifespan. Therefore, the conductive adhesive film (CF) can be used as a bonding material which enables low temperature bonding at 180℃ to reduce residual stress. In this study, two finite element models are employed to analyze the thermal deformation of solar cell using CF and solder. Thermal deformation during manufacturing process and the real used conditions has been analyzed and compared considering viscoelastic properties of CF and creep properties of lead free solder.
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