Abstract
The eutectic Sn-37Pb and Sn-Ag-Cu solders are widely used in electronic packaging processes, and the multi-layer structure Au/Ni/Cu has been utilized in the under bump metallization (UBM) or the bond pad for the printed circuit board (PCB). In this study, design of experiment (DOE) is used for a hand soldering process to find significant factors which influence mechanical strength of solder joints. Meanwhile, obtaining optimum operation conditions to make sure the reliability of solder joints in good quality is necessary. Further, the resistance variation of joint was measured. Experimental results indicate that significant factors are soldering iron temperature, soldering time, heat plate heating time and pad size in hand soldering rework processes. Due to intermetallic compounds grown weakly, the variation of resistances is unapparent. In addition, the microstructure of the solder joint has voids for lead-free and lead solders used collectively. This may reduce the joint mechanical strength.
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