Abstract

A set of electrochemical and full-scale corrosion testing methods demonstrates that 3-sulphinylalkyl-5-amino-1H-1,2,4-triazoles can be used as inhibitors of copper corrosion in neutral chloride solutions and under atmospheric corrosion. It was shown that the inhibition effect of 3-sulphinylalkyl derivatives of 5-amino-1H-1,2,4-triazole increases with the growth of the chain of the additive. By means of the impedance spectroscopy method, the authors determined that the polarisation resistance and the Warburg impedance increases whereas the double-layer capacitance decreased with the growth of the inhibitor chain and the concentration of the inhibitor. In addition, the period when the first signs of corrosion attack appear on the copper plates in the salt spray chamber increased with the growth of the inhibitor chain and its concentrations. The lowest value of this period was measured for 3-sulphinylpropyl derivatives. However, it is still 12 times higher that this value measured without any inhibitors. Full-scale testing in 1% HCl solution showed that the corrosion rate slows down by 10–20 times upon the introduction of the derivatives of 3-sulphinylbutyl and 3-sulphinylpentyl at a concentration of ≥5.00 mM. If the concentration of 3-phenethylsulphinyl is equal to or higher than 1.00 mM, then the protection level is about 85%.

Highlights

  • Due to its good thermal and electrical properties as well as resistance toward the influence of various chemical agents, copper has a wide range of industrial applications, electronics being one of them

  • We studied the copper corrosion inhibition effect of new sulphinyl derivatives of

  • In order efficiency of InEvaluation order to to ofevaluate evaluate the efficiency of the the corrosion corrosion inhibition inhibition properties properties of of the the studied studied compounds, a set of electrochemical and full-scale corrosion testing methods was used

Read more

Summary

Introduction

Due to its good thermal and electrical properties as well as resistance toward the influence of various chemical agents, copper has a wide range of industrial applications, electronics being one of them. Numerous studies of the possible inhibitors conducted to date have demonstrated that the most effective ones are organic compounds [1,2,3,4,5,6,7,8,9,10,11] acting as complex agents and adsorbates on the copper metal surface Introducing heteroatoms such as nitrogen, sulphur, and oxygen with free electron pairs as well as multiple conjugated chemical bonds and aromatic rings containing delocalised π-electrons into the structure of an organic molecule can substantially improve its inhibiting effect.

Methods
Results
Conclusion
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.