3-D Printed Rectangular Waveguide 123–129 GHz Packaging for Commercial CMOS RFICs

Abstract

This work demonstrates the hybrid integration of a complementary metal–oxide–semiconductor (CMOS) radio frequency integrated circuit (RFIC) into a host 3-D printed metal-pipe rectangular waveguide (MPRWG). On-chip Vivaldi antennas are used for TE10-to-thin-film microstrip (TFMS) mode conversion. Our packaging solution has a combined measured insertion loss of only 1 dB/transition at 126 GHz. This unique packaging and interconnect solution opens up new opportunities for implementing low-cost subterahertz (THz) multichip modules.